Meeting your expectations....
Our products covers inspection, measurement and handling solution for front-end and back-end of Semiconductor processes.
Our Inspection Equipment covers optical-based stereo, macro, and micro microscopy systems semiautomatic 2D & 3D vision systems.
- 1st Optical Inspection System
- 2nd Optical Inspection System
- 3rd Optical Inspection System
- 4th Optical Inspection System
Our Inspection Equipment covers optical-based stereo, macro, and micro microscopy systems and also fully automatic 2D & 3D vision systems.
- Post Wirebond Vision Inspection System
- Post Molding Inspection System
- Post Die Attach Inspection System
- Post Probing Inspection System
- Artificial Intelligence & Deep Learning
We work very closely with our customers as OEM manufacturers. Established local supply chains and expertise in project management providing our customers with a better cost structure at no loss in quality.
- Wafer Thickness Measurement System
- Wafer Roughness Measurement System
- Wafer Surface Measurement System
- Wafer Bump Metrology System
Know-how in robotic handling and precision motion control ensures our handling equipment always meeting customer expectations.
- Wafer Packing System
- Wafer Sorting System
- Wafer Stocking System
- Batch Wafer Transfer System
- Batch Wafer ID Reader
- Leadframe ID Laser Marking System
- Framed Wafer ID Labeling System