DIS8000
2nd Optical Inspection System
Handles 8" and 12" wafer sizes, capable of inspection of wafer post dicing, defect classification, inker classification
Key Features:
Single Wafer Autoloader for 200 and 300mm Wafer sizes.
One Load port for Standard Open Cassette
High-power microscope with Five objectives (In the range of 2.5 to 50x)
Motorized Stage for XY movements
Decoding on Customer Wafer Map to QMC Mapping system
Image capturing system
User-defined reject code & Summary Lot report after the inspection
Built-in Barcode scanner for Wafer Map Download/Upload process from the server
Description
DIS8000 is mainly designed to handle the frame wafer after the wafer dicing process. The system is able to handle 8" and 12" wafer sizes with frame/ring. Inspection of the wafer is conducted after the wafer dicing process to inspect for the defect that is observable prior to dicing and also die defect resulting after the dicing process. In general, most of the incoming wafers come with two types of detection identification methods; an Inker system on the defective die, and a Mapping system that contains the location of the defective die with classification
