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Wafer Batch Transfer system
Design for transferring, splitting, merging or flipping 6" and 8" wafers from input

WSS2200 Screenshot_edited.jpg

Key Features : 

  • Designed for 150mm and 200mm wafer

  • Four load parts available for wafer sorting vertical placement of open cassette 

  • Motorized Gripper Module equipped with 25-slots combs for wafer transferring, splitting, merging, and flipping processes

  • Equipped with reliable Cassette mapping sensor, wafer protrude sensor and cassette placement sensors

  • Product recipes manage by user-friendly GUI software

  • TCP/IP Networking for interface with host Map server, and storage of map data over the network

  • SECS/GEM Communication Tools (optional) 


WTS300G is designed for transferring, splitting, margin, or flipping the 6" wafer and 8" wafers from the input cassette in batch mode. Input cassette type of SEMI standard open cassette with 26 slots and 13 slots. It consists of four load ports which consist of 3 input load ports and 1 output load port. The system is equipped with highly accurate reflective sensors for wafer protrusion detection.

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