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Wafer Thickness & Roughness Measuring System


Key Features: 

  • Thickness resolution (0.1μm) providing uniform TTV for production control of wafers 

  • Measurements after back grind or dicing provides flexibilty for thickness uniformity control 

  • Small focused laser spot ( 1μm ) provides the resolution required for measuring bumped wafers and via features


A Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by QES Mechatronic Sdn Bhd. A non-contact measurement system measure several parameters in a single system. ( wafer & tape thicknss, roughness, TTV, bump height, bow and warp measurements ) 

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