Automated Post Probing Inspection
An ideal solution for defect detection on 8" and 12" patterned wafer sufaces.
Key Features :
26.1MP Area-Scan Color Camera
Laser Auto focus System
Nikon High Power Metallurgical Microscope
Rotary Table with Vacuum Chuck
1x Hirata FOUP Port
Hirata ATM Robot with End E_ector
Hirata Wafer Alignment Module
IOSS WID120 OCR Reader
HEPA/ULPA FFU (Optional)
The PPI3300 is an ideal solution for detecting defects on 8-inch and 12-inch patterned wafer surfaces such as scratches, ink dot smears, probe marks, watermarks, and die edge cracks. High-Speed CMOS camera with a resolution of 26.1MP and a CoaXPress interface is used in the system. The combination of 5120 x 5120 high resolution, high speed at 90 FPS and global shutter create a new standard for the inspection application. The CF objective was used to extend the working distance while maintaining a high NA, resulting in images that are crisp and clear, with high contrast and resolution. The micro wafer station has been integrated with a rotary table and an anti-vibration platform to provide accurate and high throughput inspection. Auto loading, wafer ID reader for OCR and 2D matrix code reading, and auto defect inspection are all part of the standard system configuration.