Automated Post Wirebond Inspection System
High speed stroboscopic 2D vision system for post die attach and wirebond quality. User friendly for recipe creation and management.
Key Features :
Programmable XY Stage for flexible Scanning
Programmable Magazine Elevator and Motorized Loader
High-Resolution Camera Up to 5.0MP with 2D Vision System Capability
Dual Magazine Loader with One Input & One Output
Defect Classification based on 4 Vision Tools
User-Friendly Software Control for Recipe Setup and Strip Mapping Capability
Various types of Reject Modules such as Puncher Module, Wire Breaker Module, Laser Module, etc (Selectable for One Type Only)
TCP-IP & RS232 Data Interface/SECS/GEM Data Communication (Optional)
ISP5000V is designed to inspect and quality check on lead frame and substrate after the die attach and wire bond process. The system comes with a high-speed camera with a global shutter with 2D vision inspection platform. It equipped with a stroboscopic controller that synchronizes with an encoder and camera. It is using the on-the-fly scanning method with stroboscopic control that able to eliminate the waiting time of the inspection process.