The China International Semiconductor Executive Summit (CISES) was held in Shanghai on October 24-26, attracting global semiconductor manufacturing professionals from a wide variety of equipment and material suppliers. SEMI China President Lung Chu was invited to give a speech titled “Global Semiconductor Market Updates and the Rise of China IC Industry.”
Lung Chu presented on the latest market updates for the global semiconductor industry, factors driving the market, fab capacity, Capex and equipment, and opportunities and challenges for China's development of semiconductor industry (IC design, manufacturing, packaging & testing, and equipment & materials). He mentioned that the global semiconductor output value is expected to exceed $400 billion in 2017, and offered an analysis of the driving factors.
He stated that 2017 is an excellent year for Memory, while the IOT is also a major driver for the semiconductor industry in the long run. As the semiconductor industry has migrated, Asia Pacific productivity statistics jumped to 50 percent in 2016 from less than 30 percent in 2000, of which China accounting for 12 percent. China's IC manufacturing production capacity accounts for 15 percent of the world's total, and foundries, memory and discrete devices are the main drivers of China's semiconductor production capacity.
Lung Chu pointed out that there is still a gap between China's integrated circuit industry and the international IC industry. SEMI China will need to continue to build platforms for industry exchange and cooperation. For example, during the Beijing Microelectronics Forum, the SEMI Innovation and Investment Program (SIIP) China was formally established, which is one of the most influential China-focused platforms ─ where markets, technology, talent, and funding meet. SIIP helps to accelerate healthy development of China's semiconductor industry.