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Wafer Thickness & Roughness Measuring System


Key Features
• Thickness resolution (0.1um) providing uniform TTV for production control of wafers
• Measurements after back grind or dicing provides flexibility for thickness uniformity control
• Small focused laser spot (1 um) provides the resolution required for measuring bumped wafers and via features

Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by QES Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)

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