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Advance Measuring System (AMS series)

Key Features • 1x Universal Load Port • Hirata 3-axis ATM Robot with End Effector • Wafer Mapping Sensor • Hirata Wafer Alignment Module • IOSS WID120 Reader • Sensofar Non-Contact 3D Surface Metrology System (S Neox) • Objective Lenses at 10x and 20x • Sensofar Anti-Vibration Platform • User Friendly Software Operating System

WSM1200

Designed with single cassette load port to accommodate 6" and 8" SEMI standard Open Cassette.

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Key Features • Fast, complete circular scans (360 around wafer surface) • Nomarski Viewing System for high definitic visual inspection • Scan lengths ranging from pm to comple-circumferences • (200 or 300mm wafer) • Roughness and waviness data from a single scan • Non-contact 3D scans • Automated sample positioning (X, Y, theta) • Customized measurement sequences with multiple scans implemented with a single keystroke • Automated focus acquisition • Closed loop auto-focus system allows focus to be maintained while scanning over samples with varying topography • Optional robotic handling

MPS2100

Designed for surface measurements and analysis, it can be used as both a production tool for inline quality inspection, as well as a research and development tool for establishing standards and researching tolerances.

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Key Features • Thickness resolution (0.1um) providing uniform TTV for production control of wafers • Measurements after back grind or dicing provides flexibility for thickness uniformity control • Small focused laser spot (1 um) provides the resolution required for measuring bumped wafers and via features

MPT1000

Wafer Thickness & Roughness Measuring System

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