Wafer Packing System
Designed to handle 6" & 8" wafer for packing & unpacking process from various type of wafer shipping carries.
• 2x Open Cassette Station
• 2x Wafer Canister/Jar Station
• 1x Interleaf Station
• Hirata 4-Axis ATM Robot (Radius-Theta-Height-Flip Axes)
• 2-Axis Cartesian Robot with Bernoulli
• Hirata Wafer PreAligner
• IOSS WID120 OCR Reader
• Vision Sensor for Wafer, Paper or Spacer Detection
WPS3200 is designed to handle 6” & 8” wafer for packing & unpacking process from various type of wafer shipping carriers. The system equipped with Hirata PreAligner for wafer positioning and orientation and wafer ID Reader for OCR and 2D matrix code reading. Beside, WPS3200 comes with built-in vision sensor for wafer, interleaf paper or ring spacer detection and built-in height sensor for robotic handling accuracy. Mapping sensor integrated with robotic arm to detect any wafer cross slot and double wafers during operation.