Automated Post Wire Bond Inspection System
High resolution and speed of vision inspection system, PWB2000 is automated, reliable solution for post die attach and post wire bond inspection. The system comes with the area scanning camera that is capable to capture defects by using the 2D vision system. Integrated with programmable dual XY stage and on-the-fly scanning method, the system can accommodate multiple magazines at one time operation and elimate the waiting.

Automated Post Wire Bond Inspection system
High speed stereoscopic line-scanning 3D vision inspection system designed to meet the high throughput demand in semiconductor die-attach and wirebond inspection. Utilizing dual CCD line-scan camera system from Chromasens Germany, the integrated stereo optical assembly with factory pre-calibrated 3D algorithms ensuring consistent and accurate measurement at all time.

Automated Post Wirebond Inspection System
High speed stroboscopic 2D vision system for post die attach and wirebond quality. User friendly for recipe creation and management.

Automated Post Wire Bond Inspection System
QMC automatic die- attach vision inspection system is designed to handle panel inspection. The vision capability is integrated with Keyence vision platform. The vision method using template matching which means it’s compares the image obtained with the image from golden unit , in same device type.
The system is equipped with high brightness illuminator, which produces high quality of image for better vision judgement and performance.

Automated Post Die Attachment Inspection
PDA1000 is specially designed for IGBT and MOSFET devices handling. It is equipped with high speed, high resolution and high accuracy vision system. The system is integrated with dual-track system, each track is specifically designed to run in two different inspection modes: Track A for top inspection and Track B for full inspection mode inclusive of 4 lateral sides, top and bottom respectively. This intelligent design provides the flexibility to choose inspection modes depending on the type of application.

Automated Post Mold Inspection System
PMI2000 is an automated 2D vision inspection system for molded device. It comes with top and bottom vision inspection capability, by using high resolution camera, lens and illumination. The system is able to provide a wide field of view area capture vision system which results in faster image processing and higher UPH yield.

Automated Post Molded Inspection System
Vision Inspection System for Molded devices. Comes with high resolution camera with up to 1.3x magnification and illumination. Capable to capture small defect sizes up to 10x10 microns under 1.3x lens magnification. Consists of configurable input/output loader for both stacekd magazine and shipping box.

Automated Post Die Attach Inspection System
PDA100K is made for automated optical inspection system towards die on ceramic panels. System comes with 2D inspection on die placemnet and comestics defects, as well as 3D Inspection on stack height. The combination of 2D & 3D laser profile ensures the optimal inspection accuracty covering all possible detections on the die.

Automated Post Probing Inspection
The PPI3300 is an ideal solution for detecting defects on 8-inch and 12-inch patterned wafer surfaces. High Speed CMOS camera with resolution of 26.1MP and CoaXPress interface is used in the system. Auto loading, wafer ID reader for OCR and 2D matrix code reading, and auto defect inspection are all part of the standard system configuration.