top of page

Optical Inspection System (OIS series)


3rd Optical Inspection System
Designed to handle lead frames or substrates for visual inspection and yield management after die attach and wire bonding process. It’s equipped with strip mapping system and auto-conversion mechanism for different types of packages. It’s capable to perform physical marking with various types of reject identification module such as puncher, wire breaker, bristle, scriber, inker, laser wire breaker and laser clip bond cutter.


2nd Optical Inspection System
DIS8000 is designed to handle frame wafers post wafer dicing process. It is able to inspect defects that are observable prior to dicing and also die defects resulted post dicing process. It’s equipped with two types of defect identification methods, inking on the defective die and wafer map containing locations of the defective die with classification. The system is capable of performing wafer backside inspection


1st Optical Inspection
WIS8000 is designed to handle 8" and 12" wafer size. It comes with wafer gripper with tilting capability for front and back wafer inspection (macro inspection). High-power microscope with 5 objectives for the micro inspection also included.



1st Optical Inspection System
WIS1100 is designed to handle 4" and 6" wafer size for the optical inspection, wafer mapping and defect classification management. System comes with high performance macro inspection for front and back wafer including micro inspection system. The Pre-aligner is used to ensure wafer centering and orientation accuracy before unloading.

WIS1000 Alt text


1st Optical Inspection System

WIS1000 is designed to handle 6" wafer and 8"wafer sizes. The standard design comes with one standard load port which can accommodate the 6" SEMI Standard Open Cassette and 8" SEMI Standard Open Cassette . The system is capable for inspection, wafer mapping and defects classification management. WIS1000 is integrated with Nikon Wafer Auto-Loader and programmable XY indexing table for macro and micro inspection. It can perform macro inspection not only for front wafer as well back wafer and micro inspection. Inker module can be integrated with the system for the defect marking during inspection.


bottom of page